Introduction, Microstructure of Materials, Materials Mechanics, Contact Mechanics, Mechan-ics of Thin Films, Mechanics of small scale structures, Size effects, Micromechanical sample preparation, Small scale mechanical testing techniques and instrumentation, Methods to as-sess adhesion, residual stress, and tribological properties.

 

The course focuses on mechanics of solid thin films and small scale structures. It commences with a review of concepts in materials microstructure (bond types, crystallography, amorphous materials) and material mechanics (stress and strain, linear elasticity, plasticity, linear fracture mechanics, time-dependent behavior, fatigue). This is followed by an overview of the field of contact mechanics. A brief introduction is given concerning deposition and characterization methods. Stress evolution in thin films is covered in detail as is the effect stress may have on the solid thin film failure (e.g. fracture mechanics of the interfaces and thin films, delamination and buckling of thin films, contract fracture mechanics). Testing methods to assess film adhesion, residual stress levels and tribological properties are re-viewed. Further, lectures will cover size effects encountered when testing intrinsic properties of microscale samples and thin films. Lectures will be example intensive, with a due attention given to understanding mechanics of these important examples. A whole section of the course will be focusing on state-of-the-art experimental techniques available today for evalua-tion and extraction of thin films and small scale structure mechanical properties  (nanoinden-tation, micropillar compression, microtension, experiments at cryogenic or elevated tempera-ture, high strain rate testing). The block-type half day course lectures conclude with instru-ment demonstrations and related laboratory training and exercises. The last course day will conclude with an extended 4 hours laboratory exercise.