General introduction: What is printing? Historical background, Printed electronics and large area manufacturing: materials, processes, devices and systems, Unique aspects of printable electronics, Status in the field and trends.

Organic semiconductors: Introduction to organic semiconductors, From chemical bonds to bands, Charge injection and transport, Optical properties, Examples of relevant printable electronic and functional materials.

Printing and other large area processes: Basics and fundamentals,Fluid formulation and rheology for pritning, Ink-substrate interaction, Inks and printing techniques: gravure, flexography, screen, inkjet, Coating techniques, Laser processes, Additional coating and structuring techniques. Ink drying, curing and sintering: oven, UV, plasma, microwave, photonic techniques.

Electrons to light and light to electrons: OLEDs and OPVs: Introduction and history: organic light emitting diodes and organic photovoltaics, Basic device structures and operation, Processing: evaporation/ solution processing, lab to fab, sheet and roll processes, Packaging and encapsulation considerations, Figures of merit and relation to applications.

Energy storage and harvesting: Principles of battery and supercapacitors, architectures, printed of energy sources and storage components, Mechanical and thermal harvesters, rectennas.

Sensors and actuators: Printed sensors and Actuators, Chemical: liquid and gas phase, Biosensors, Physical sensors: temperature, pressure and touch, light, Microsystems and MEMS, Actuators, Lab-on-chip and microfluidics.

TFTs and circuits: Introduction about printed transistors: organic/polymer, metal-oxide, electrolyte gated. CSEM’s case studies: submicrometer OTFTs and gravure printed OTFTs, From transistors to circuits (modeling, design kit, technology assessment).

Heterogeneous integration and Smart systems: Introduction to integration methods: one Foil vs. Foil-to-Foil approaches, System in Foil, Hybrid integration: SMD and printed component on foil, CSEM’s case studies: high-pass audio filter and sun sensor, Passive components: Resistors, capacitors, inductors, Memories: Resistive, ferroelectric, write-once-read-many (WORM), RFID, wireless and smart systems.

Encapsulation:Introduction, relevance, encapsulation of large area printed / organic electronics, Permeation in solids and thin films, Examples of barriers materials and processing for different devices and systems, Characterization and evaluation of encapsulation.

Large area manufacturing of printed systems: Challenges: from small to large area, All printed vs. hybrid, Sheet to sheet vs. roll to roll, Examples of manufacturing lines, Characterization techniques for LAM, Environmental aspects.

Applications, commercial products and market, roadmap and innovation: Roadmapping : what is it?, Application examples ( e.g. OLED, OPV, hybrid and integrated systems), Innovation management in printed electronics.