Coursebooks 2017-2018

PDF
 

Laser microprocessing

MICRO-520

Lecturer(s) :

Hoffmann Patrik

Language:

English

Summary

The physical principles of laser light materials interactions are introduced with a large number of industrial application examples. Materials processing lasers are developing further and further, the lecture presents the physical limitations of the processes.

Content

1. Basics of laser processing

Lasers for machining, Optics - beam steering systems, beam quality; Optical properties of materials, Heat equation, Applications - and examples:

Laser induced chemical reactions at surfaces for marking applications,

laser bending,

hole drilling,

laser cutting,

laser induced ablation,

gnerative processes

Keywords

laser, efficiency, beam quality, spot size, laser pulse duration, heat equation, losses, machining, marking, bending, drilling, cutting, ablation, generative processing, selective laser sintering, selective laser melting

Learning Outcomes

By the end of the course, the student must be able to:

Expected student activities

participate actively in the lecture

carry out exercises

Assessment methods

Oral examination

In the programs

  • Microengineering, 2017-2018, Master semester 2
    • Semester
      Spring
    • Exam form
      Oral
    • Credits
      2
    • Subject examined
      Laser microprocessing
    • Lecture
      2 Hour(s) per week x 14 weeks
  • Microengineering, 2017-2018, Master semester 4
    • Semester
      Spring
    • Exam form
      Oral
    • Credits
      2
    • Subject examined
      Laser microprocessing
    • Lecture
      2 Hour(s) per week x 14 weeks

Reference week

MoTuWeThFr
8-9
9-10
10-11
11-12
12-13
13-14 CM011
14-15
15-16
16-17
17-18
18-19
19-20
20-21
21-22
Lecture
Exercise, TP
Project, other

legend

  • Autumn semester
  • Winter sessions
  • Spring semester
  • Summer sessions
  • Lecture in French
  • Lecture in English
  • Lecture in German